Me ka hoʻomohala ʻana o ka ʻoihana ʻoihana i ka ʻoihana hana, ke pāʻani nei ke kiʻi ʻoniʻoni ʻana i nā hana koʻikoʻi i ke kaʻina hana hana hou.

1.Rolling kaomi ho'āʻo
ʻO ke kaomi ma waena o ka'ōwili a me ka'ōwili paʻi pōʻai, ka'ōwili paʻa o ka mea kope, ka'ōwili paʻi, ke kaomi ma waena o nā wili laminate, ka paʻa paʻa o ka pā offset, ka hui pūʻana o ka lipine wili, ka'ōwili paʻi o ke kiʻi hana kiʻekiʻe, ka'ōwili o ke kāʻei conveyor.

2. Hoʻopaʻa
ʻO ke kaomi o ka ili paʻa, no ka laʻana, engine, gearbox, Turbo, valve, pump hydraulic cylinder and compressor. E nānā i ka hana hoʻopaʻa ʻana o nā gaskets, sealing apo a me O-rings.

3.Contact Pressure
Hoʻokaʻaʻike kaomi ma waena o ka uhaki, clutch a me ka piston、Contact pressure of welding machine、Contact pressure of IC radiator.

4.Compaction Pressure
Laminated kaomi o ka plywood a me ka laminate、ka hoʻopaʻa kaomi o ka LCD panel、wafer hoʻopaʻa kaomi、ka hui puʻe o ka wahie cell、boi puʻe o laminated paʻi papa, hoʻopaʻa kaomi o adhesive conductive film (ACF) 、hui puʻe o laminated ceramic capacitance.

5.Supporting kaomi
Kākoʻo i ke kaomi o nā kaʻa a me ke kāʻei kolo; e kākoʻo ana i ke kaomi ʻana i nā mīkini, nā kāʻei a me nā pahu.

6. Pumi Pumi
ʻO ke kaomi wiliwili o ka kiʻiʻoniʻoni kiʻekiʻe a me ka pepa , ke kaomi ʻana o ka coil.

7. Coating Pressure
ʻO ke kaomi uhi o ka paʻi pale (paʻi substrate, etc.).

8.Contact kūlana
Ke kūlana pili o ka paʻi paʻi ʻana, nānā kaulike o ka mīkini hoʻopaʻa paʻi, kūlana pili o ka mīkini hoʻopaʻa paʻi, offset paʻi pahu paʻi paʻi paʻi, kūlana pili o ka surface polishing disk (CMP), kūlana pili o ka laminating machine roll, polishing pressure of silicon wafer, piʻi piʻi o semiconductor chip.

9.Surge Pressure
ʻO ka hoʻāʻo ʻana o ka baseball, ka pōleʻa kolepa a me nā mea hana ʻē aʻe, ka hoʻāʻo hāʻule ʻana o ka pūʻolo, ke kaomi hopena o ka wai hoʻoheheʻe wai, ke kaomi hopena o nā waiwai i ke kaʻina o ka lawe ʻana, ke kaomi haʻalulu o ka buffer a me ka ʻeke air.